HiLink Inc. — Form D
HiLink Inc. of CHICAGO, IL, a company, filed a Form D exempt-offering notice with the SEC on 2021-10-21. The offering totals $750K, of which $75K was reported sold. Industry: Other Technology.
Offering
- Filed: 2021-10-21
- Form: D
- Accession: 0001888748-21-000001
- Industry: Other Technology
- Exemptions: 06b
- Total offering: $750K
- Amount sold: $75K
- Remaining: $675K
- Minimum investment: $1
- Investors: 1
- Date of first sale: 2021-10-01
- Security types: equity, debt
- Revenue range: Decline to Disclose
- SEC file number: 021-417965
Issuer
- Name: HiLink Inc.
- CIK: 0001888748
- Entity type: Corporation
- Jurisdiction: DELAWARE
- Incorporated: 2021
- Address: 401 N MICHIGAN AVE, CHICAGO, IL, 60611
- Phone: 3124858815
Officers, directors & promoters (2)
| Name | Role | Location |
|---|
| Fuchen Wu | Director | Chicago, IL |
| Fuchen Wu | Executive Officer | Chicago, IL |
Other filings by this issuer (2)
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