HiLink Inc. — Form D/A
HiLink Inc. of CHICAGO, IL, a company, filed a Form D amendment with the SEC on 2022-06-16. The offering totals $950K, of which $950K was reported sold. Industry: Other Technology.
Offering
- Filed: 2022-06-16
- Form: D/A
- Accession: 0001888748-22-000002
- Industry: Other Technology
- Exemptions: 06b
- Total offering: $950K
- Amount sold: $950K
- Minimum investment: $1
- Investors: 11
- Date of first sale: 2021-10-01
- Security types: equity, debt
- Revenue range: Decline to Disclose
- SEC file number: 021-417965
Issuer
- Name: HiLink Inc.
- CIK: 0001888748
- Entity type: Corporation
- Jurisdiction: DELAWARE
- Incorporated: 2021
- Address: 401 N MICHIGAN AVE, CHICAGO, IL, 60611
- Phone: 3124858815
Officers, directors & promoters (2)
| Name | Role | Location |
|---|
| Fuchen Wu | Director | Chicago, IL |
| Fuchen Wu | Executive Officer | Chicago, IL |
Other filings by this issuer (2)
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